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Return to FAQs Matrix Acid Copper Electroplating platicon.gif

 

Questions about:

Plating baths

  1. Can I use copper sulfate that is in powder form? I'm not so sure how to mix it, since the guide I have only deals with liquid copper sulfate.

Holewall Activation

  1. How many boards can I make with a bottle of conductive ink? I just want to know how long a bottle will last if I am making boards on a regular basis.
  2. What is the shelf-life of the conductive ink? Do I need to refrigerate the ink between uses?
  3.  

Plating in General

  1. What will the effect be if I reduce or increase the plating current to a value other than that calculated using your formula?
  2. Why are some of the through-holes in my board not plating? Some are partially covered with copper while others do not seem to have been plated at all.
  3. Why are my plated boards coming out rough, like copper plated sandpaper?
  4. Why is my plated copper coming out dull? Does it matter?
  5. How many boards can I plate with a standard charge of anode material?

Panel Plating

Pattern Plating

  1. When I am going to pattern plate my circuit anyway, why do I first have to panel plate the board just after holewall activation?
  2. How do I determine the total surface area of exposed copper when I am pattern plating?
  3. How do I account for the area of the holewalls when I am pattern plating?
  4. Why are some of the through-holes in my board not plating? Some are partially covered with copper while others do not seem to have been plated at all.

Hull Cell Operation

 


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March, 2008

 

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