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Photopolymer Dry-film Developing Module
Operation/Developing photoresist and soldermask I

Developing photoresist and soldermask

Wear a lab smock, gloves and eye protection when handling and/or using developing and stripping solutions!

Mounting board in clamp Fig. 5
After you have imaged the laminated photopolymer (resist or soldermask) and have let the board sit for 15 minutes:
  1. Peel the Mylar cover sheet(s) off of the photopolymer.
  2. Mount the board into the board clamp. (Fig. 5)
  3. Hang the board vertically in solution. The board must be totally covered by developing solution.
  4. Using the air switch on the front panel, turn on the air agitation.
  5. Develop the board for T/2.
  6. Flip the board top-to-bottom, and left-to-right and develop for T/2.
  7. Lift the board from the solution and allow most of the developer to drain back into the tank.
  8. Rinse both sides of the board with warm tap water, using a spray wand if available.
  9. While rinsing the board, vigorously rub the photopolymer with a wet kitchen sponge to remove any partially dissolved material from the nooks and crannies of the developed pattern.
This probably sounds like the last thing that you should do the the tiny little pads and traces that make up a resist pattern. However, if the dry-film will not hold up to the abrasion of a soft kitchen sponge, it will probably fail during etching. Even if the film does survive the etchant without lifting off and exposing the underlying copper, failure.

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