Think & Tinker, Ltd.
P.O. Box 1606, Palmer Lake, CO 80133
Tel: (719) 488-9640, Fax: (866) 453-8473
Sales: Sales@thinktink.com, Support: Support@thinktink.com
Photopolymer Dry-film Developing Module
Operation/Developing photoresist and soldermask I
Developing photoresist and soldermask
Wear a lab smock, gloves and eye protection when handling and/or using developing and stripping solutions!
Mounting board in clamp Fig. 5
After you have imaged the laminated photopolymer (resist or soldermask) and have let the board sit for 15 minutes:
This probably sounds like the last thing that you should do the the tiny little pads and traces that make up a resist pattern. However, if the dry-film will not hold up to the abrasion of a soft kitchen sponge, it will probably fail during etching. Even if the film does survive the etchant without lifting off and exposing the underlying copper, failure.
- Peel the Mylar cover sheet(s) off of the photopolymer.
- Mount the board into the board clamp. (Fig. 5)
- Hang the board vertically in solution. The board must be totally covered by developing solution.
- Using the air switch on the front panel, turn on the air agitation.
- Develop the board for T/2.
- Flip the board top-to-bottom, and left-to-right and develop for T/2.
- Lift the board from the solution and allow most of the developer to drain back into the tank.
- Rinse both sides of the board with warm tap water, using a spray wand if available.
- While rinsing the board, vigorously rub the photopolymer with a wet kitchen sponge to remove any partially dissolved material from the nooks and crannies of the developed pattern.
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