Think & Tinker, Ltd.
P.O. Box 1606, Palmer Lake, CO 80133
Tel: (719) 488-9640, Fax: (866) 453-8473
Sales: Sales@ThinkTink.com, Support: Support@ThinkTink.com
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Tin/Lead Electroplating Module
-Operation/Panel vs. Pattern IV

  1. Turn the current down and flip the board in the clamp top to bottom and left to right. This will help minimize any plating non-uniformity that results from asymmetric, inconstant plating conditions.
  2. Lower the board back into the bath.
  3. Swish the board gently back and forth to drive any trapped air bubbles out of the through holes.
  4. Turn on the air compressor and adjust the air flow until a uniform blanket of agitation roils the top of the bath on both sides of the board. You only need about 2 CFM (Cubic Feet per Minute) of air flow per square foot of bath surface.
  5. Slowly ramp up the current (take about 20 sec.) to the value C calculated above.
  6. Plate the board for the remaining ½TC.
  7. Remove the board from the bath and thoroughly rinse in the "acid copper" rinse tank to remove most of the electrolyte. Rinse the board under running tap water to remove the rest. Note: If no outside contamination is introduced, and if the rinse tank is only used after acid copper plating, the water in the "acid copper" rinse tank can be added back into the plating bath to make up for drag out and evaporative losses. This is crucial to reducing the effluent from this process to near zero.
  8. Dip the board into a 10% solution of SolderPlate 60/40 acid to minimize the introduction of contaminants into the tin/lead cell.
  9. Attach the tin/lead cathode clamp to the board, making certain that both copper surfaces have good electrical contact to the negative terminal of the plating power supply.
  10. Turn the power supply on.
  11. Lower the board into the solder plating.
  12. Swish the board gently back and forth to drive any trapped air bubbles out of the through holes
  13. Slowly ramp up the current (take about 20 sec.) to the value C calculated above.
  14. Plate the board for the total tin/lead plating time (TL) calculated above.
  15. Remove the board from the bath and allow any electrolyte to drip back into the bath.
  16. Thoroughly rinse the board in the "tin/lead" rinse tank to remove any remaining electrolyte. Rinse the board under running tap water to remove the rest. Blow dry Note: If no outside contamination is introduced, and if the rinse tank is only used after tin/lead plating, the water in the "tin/lead" rinse tank can be added back into the plating bath to make up for drag out and evaporative losses. This is crucial to reducing the effluent from this process to near zero.
  17. The plated board is now ready for further processing.

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Established 1990

On the web since 1994

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Copyright © 1994 - 2014 Think & Tinker, Ltd. Updated 2/13/2014 8:36:58 AM