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Tin/Lead Electroplating Module
Model 4000
-Table of Contents

Green CirKit PCB Prototyping

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Overview
    Plating Cart Components
Getting things ready
    Unpacking
    Leaching
    Draining and purging the system
    Filling with SolderPlate electrolyte
    Dummy Plating
Operation
    Overview
    The Downside of Tin/Lead Plating
    Basic principles
    Organic additives
    Panel vs. pattern plating
Chemical Analysis
    Safety
        DO
        DON'T
    Analysis tools
        Automatic pipettor
        Digital titrator
The Hull Cell
    Principle of Operation
        Equipment Required:
        Reagents Required:
        Procedure:
Titration Analysis Techniques
    SolderOn Acid Analysis
        Equipment Required:
        Reagents Required:
        Procedure:
    Tin (as stannous tin) Analysis
        Equipment Required:
        Reagents Required:
        Procedure:
    Lead (as lead sulfate) Analysis
        Equipment Required:
        Reagents Required:
        Procedure:
Maintenance
    Fixing a leaky connection
    Cleaning

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Updated
March, 2008