Think & Tinker, Ltd.
P.O. Box 1606, Palmer Lake, CO 80133
Tel: (719) 488-9640, Fax: (866) 453-8473
Sales: Sales@ThinkTink.com, Support: Support@ThinkTink.com
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Tin/Lead Electroplating Module
-Hull Cell/Principle of Operation


peeling cover from test plate
Fig. 10
  1. Remove the drain cap and use the drain line to fill a 1 liter pitcher with electrolyte (image).
  2. Turn the drain valve to OFF (fig. 5), the pump valve to RECIRCULATE (fig. 6), and replace the drain cap.
  3. Fill the cell to the line marked on the side (fig. 11).
  4. Peel the thin plastic cover sheet off of the copper test plate and face the mirror bright surface toward the anode. This VERY smooth surface will act as the target for copper plating and will vividly show any defects in the plating process (fig.10).
  5. Connect the corrugated anode to the positive (+) terminal of the power supply and the test plate to the negative (-) terminal.
  6. If the power supply can source more than 2 Amps, adjust it's output until it is sourcing 2 Amps.
  7. Plate the test panel for 10 minutes.

Filling Hull Cell
Fig. 11
  1. Remove the panel from the bath, thoroughly rinse under cool tap water, and carefully dry with a non-abrasive tissue.
  2. Examine the test plate carefully. A properly adjusted bath will yield a test plate that is a uniform gray-white matte across the entire panel.
  3. If the plate shows a dark band in the mid to high current density areas or bright banding in the mid regions, the additive level in your bath is probably too low, or the bath has become contaminated with organic leachings from dry film plating resist. (This assumes that you have conducted all of the previous chemical analysis tests and have adjusted the bath to be at the optimum point for each parameter).

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Established 1990

On the web since 1994

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Copyright © 1994 - 2014 Think & Tinker, Ltd. Updated 2/13/2014 8:36:58 AM