Think & Tinker, Ltd.
P.O. Box 1606, Palmer Lake, CO 80133
Tel: (719) 488-9640, Fax: (866) 453-8473
Sales: Sales@ThinkTink.com, Support: Support@ThinkTink.com
PREVIOUS NEXTTin/Lead Electroplating Module
-Hull Cell/Principle of Operation
The Hull Cell
The brightener/leveler formulation developed by Lea Ronal is a two part part additive system that functions to smooth out and distribute the solder plated onto the surface and in the holes of a PCB. At the current time there is no simple test to directly analyze the additive or carrier levels in the bath or to determine if they are in balance with the other functional constituents. There is, however, a rather simple technique to infer when the additive level needs attention and to determine just how much material to add. This technique uses a miniature plating cell commonly known as the Hull Cell. Using the procedure described below, the cell is used to test plate a series of sample boards to determine when the bath needs adjustment, and, when used with the above analytical techniques, to determine how much of to add. PC SolderOn Carrier is normally maintained through routine replenishment of PC SolderOn Additive which contains small quantities of Carrier.
Principle of Operation
The Hull Cell is intended to act as a quick check on the health of the tin/lead plating bath. Using the cell in conjunction with the chemical analyses it is possible to qualitatively and quantitatively analyze all of the major constituents of the bath.
When filled to the line marked on the side of the cell, the volume of the test sample is 267 ml. If we denote:
C = (V/0.267) x H